BOYD CORP MPN:374324B60023G. Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm. Type of heatsink extruded. Heatsink shape grilled. Need more?. Service and information. Weight: 8 g. Colour black.
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Copper Shim Heatsink Thermal Pad, 2 Pcs Copper Heatsink Sheets 15x15mm/20x20mm Thickness 0.3-2.0mm Thermal Pad(20x20x1.2mm)
Copper Shim Heatsink Thermal Pad, 2 Pcs Copper Heatsink Sheets 15x15mm/20x20mm Thickness 0.3-2.0mm Thermal Pad(15x15x0.8mm)
Copper Shim Heatsink Thermal Pad, 2 Pcs Copper Heatsink Sheets 15x15mm/20x20mm Thickness 0.3-2.0mm Thermal Pad(15x15x1.2mm)
